Ceramic Semiconductor Packages

Don forbes rex rice and bryant rogers invented a 14 lead ceramic dual in line package dip with two rows of pins.

Ceramic semiconductor packages.

However the simple construc. Spectrum semiconductor materials extensive inventory of ceramic cerpac packages are available in 14 18 20 24 and 28 pin configurations. These packages protect the crystal with full hermetic sealing for high reliability while measuring just 1 0 x 0 8 mm among the world s smallest. Is a world wide authorized distributor of packages and lids for ic assembly.

The first semiconductor package. Three engineers from fairchild. These ceramic and metal can packages are of. A semiconductor package is a metal plastic glass or ceramic casing containing one or more discrete semiconductor devices or integrated circuits individual components are fabricated on semiconductor wafers commonly silicon before being diced into die tested and packaged the package provides a means for connecting it to the external environment such as printed circuit board via leads.

A circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern. The pressed ceramic packages are typically lower in cost than the multilayer packages. Dip packages came into volume production in early 70 s. Ultra small ceramic packages help miniaturize highly functional crystal devices which are essential in electronics.

A package with metric pin distribution 0 5 mm pitch. For 30 years our proven track record consistent customer service and long standing supplier relationships makes us the premier distributor for your ic packaging needs. This was the first real semiconductor package. Ceramic column grid array ccga.

Kyocera will exhibit its ceramic packages for mems and sensors at apcot 2016. Ball spacing less than 1 mm. Cerpac packages sold in three separate components cerpac base cerpac frame and cerpac cap. Depending on the application weight thermal solution and material requirements ametek can help you design a package using one of these technologies to best meet your requirements.

Ametek offers both glass to metal seal and ceramic to metal seal technology to its customers. Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition. Hermetic packages national semiconductor offers a wide variety of ceramic and metal can packages for through hole and surface mount ap plications. Located in silicon valley spectrum semiconductor materials inc.

High pin count semiconductor packaging. The body of the component is ceramic.